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SiC Substrate 4inch P-type 4H/6H-P N-type 3C-N Zero Grade Production Grade Dummy Grade
P-type SiC Substrate's abstract
P-type Silicon Carbide (SiC) substrates are essential in the development of advanced electronic devices, particularly for applications requiring high power, high frequency, and high temperature performance. This study investigates the structural and electrical properties of P-type SiC substrates, emphasizing their role in enhancing device efficiency in harsh environments. Through rigorous characterization techniques, including Hall effect measurements, Raman spectroscopy, and X-ray diffraction (XRD), we demonstrate the superior thermal stability, carrier mobility, and electrical conductivity of P-type SiC substrates. The findings reveal that P-type SiC substrates exhibit lower defect densities and improved doping uniformity compared to N-type counterparts, making them ideal for next-generation power semiconductor devices. The study concludes with insights into optimizing P-type SiC growth processes, ultimately paving the way for more reliable and efficient high-power devices in industrial and automotive applications.
P-type SiC Substrate's properties
Property | 4H-SiC (P-type) | 6H-SiC (P-type) | 3C-SiC (N-type) | Zero Grade | Production Grade | Dummy Grade |
---|---|---|---|---|---|---|
Crystal Structure | Hexagonal | Hexagonal | Cubic | Highest purity and minimal defect density | High quality for production environments | Used for equipment setup and testing |
Conductivity Type | P-type | P-type | N-type | Near-zero micropipe density | Controlled defect density and doping | Lower purity, may contain defects |
Doping Type | Typically Al or B doped | Typically Al or B doped | Typically N doped | Extreme precision for critical applications | Optimized for consistent performance | Not optimized for electrical properties |
Substrate Size | 4-inch diameter | 4-inch diameter | 4-inch diameter | Size consistency with low tolerances | Standard sizes with industry tolerances | Typically same size as production-grade |
Micropipe Density | <1 cm² | <1 cm² | <1 cm² | Ultra-low micropipe density | Low micropipe density | Higher micropipe density |
Thermal Conductivity | High (~490 W/m·K) | Moderate (~490 W/m·K) | Lower (~390 W/m·K) | High thermal conductivity | Maintains high conductivity | Thermal properties similar to production |
Surface Roughness | Atomically smooth | Atomically smooth | Slightly rougher | Atomically smooth | Polished for device fabrication | Not polished, intended for testing |
Carrier Mobility | High | Moderate | Lower than 4H/6H | Highest mobility for precision devices | Sufficient for production-grade devices | Not characterized for mobility |
Typical Applications | Power electronics, RF devices | Power electronics, LEDs | Power electronics, research | High-end research, advanced semiconductor devices | Mass production of devices | Equipment calibration, process development |
P-type SiC Substrate's data sheet
P-type SiC Substrate's application
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