Introduction of SiC Ceramic Fork Arm
The SiC ceramic fork arm, also known as a ceramic end effector, is a high-performance robotic component designed for ultra-clean
and high-precision wafer handling applications in semiconductor
manufacturing. Crafted from advanced silicon carbide (SiC) ceramics, this end effector offers outstanding mechanical strength, low
thermal expansion, and excellent chemical resistance—making it
ideal for demanding process environments such as vacuum chambers,
high-temperature zones, and corrosive gas atmospheres.
Unlike traditional metal or quartz end effectors, the SiC ceramic
fork arm ensures minimal particle generation and thermal
distortion, offering long-term reliability and precision alignment
for wafer transfer, positioning, and load/unload operations.
Manufacturing Principle of SiC Ceramic Fork Arm
The SiC ceramic end effector is manufactured using reaction-bonded silicon carbide (RB-SiC) or pressureless sintered silicon carbide (SSiC). The production process typically includes:
Powder Processing: High-purity SiC powder is blended with binders and additives.
Molding/Forming: Using techniques such as cold isostatic pressing (CIP) or
injection molding to shape complex geometries, including thin fork
arms or pronged structures.
Sintering: Heat treatment at temperatures over 2000°C ensures high
densification, strength, and microstructural uniformity.
Precision Machining: CNC grinding and diamond polishing are used to achieve
dimensional tolerances down to microns and ultra-flat surfaces,
minimizing damage to wafers.
Final Inspection: Non-destructive testing (NDT), dimensional checks, and surface
roughness testing ensure each ceramic end effector meets
semiconductor-grade standards.
This entire process ensures the end effector retains excellent stiffness, lightweight properties, and
non-reactivity in challenging working environments.
Applications of SiC Ceramic Fork Arm
The SiC ceramic fork arm / end effector is widely used in semiconductor, photovoltaic, and microelectronic
fields. Key applications include:
Wafer Transfer Systems: For handling 6-inch to 12-inch wafers during IC fabrication.
Robotic Arms in Vacuum Chambers: For pick-and-place in CVD, ALD, and dry etching processes.
FOUP/FOSB Load Ports: Integration into robotic systems for transferring wafers between
carriers and process modules.
Cleanroom Automation: In high-throughput semiconductor production lines where
ultra-clean handling is essential.
Laser Processing or Annealing: Where high temperature resistance and non-contamination are
critical.
Its end effector function ensures delicate yet firm gripping of semiconductor
wafers without mechanical stress or contamination.
Advantages of SiC Ceramic Fork Arm
High Purity: Excellent resistance to contamination.
Thermal Stability: Maintains rigidity and shape under thermal cycling.
Low Thermal Expansion: Prevents thermal deformation, improving wafer alignment.
Chemical Resistance: Inert to corrosive gases and plasma environments.
Mechanical Strength: Resistant to fracture, chipping, and warping under mechanical
load.
Surface Flatness: Ultra-smooth contact surfaces reduce wafer scratching risk.
Specifications of SiC Ceramic Fork Arm
Main Specifications of CVD-SIC Coating |
SiC-CVD Properties |
Crystal Structure | FCC β phase |
Density | g/cm ³ | 3.21 |
Hardness | Vickers hardness | 2500 |
Grain Size | μm | 2~10 |
Chemical Purity | % | 99.99995 |
Heat Capacity | J·kg-1 ·K-1 | 640 |
Sublimation Temperature | ℃ | 2700 |
Felexural Strength | MPa (RT 4-point) | 415 |
Young’ s Modulus | Gpa (4pt bend, 1300℃) | 430 |
Thermal Expansion (C.T.E) | 10-6K-1 | 4.5 |
Thermal conductivity | (W/mK) | 300 |
FAQ – Frequently Asked Questions of SiC Ceramic Fork Arm
Q1: Why choose a SiC ceramic end effector over quartz or aluminum?
A1: SiC ceramics offer superior thermal resistance, mechanical
strength, and longer service life compared to quartz or metal
materials, especially in harsh plasma or high-temperature
environments.
Q2: Can the ceramic fork arms be customized to fit my robot or
wafer size?
A2: Yes. We offer full customization of fork arm geometry, slot
dimensions, and mounting interfaces to match your robotic system
and wafer specifications.
Q3: Are these end effectors safe for use in vacuum or plasma
systems?
A3: Absolutely. SiC ceramics are fully compatible with ultra-high
vacuum (UHV), plasma etching, and reactive ion etching (RIE)
environments due to their chemical inertness and low outgassing.
Q4: How durable is the SiC ceramic fork arm under repetitive use?
A4: SiC’s high hardness and toughness allow it to withstand repeated
thermal cycles and mechanical handling without degradation, making
it ideal for continuous production environments.
Q5: Do you provide testing or certification for each end effector?
A5: Yes, all products undergo rigorous dimensional inspection,
flatness testing, and material verification. Certificates of
compliance (CoC) and test reports can be provided upon request.
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About Us
ZMSH specializes in high-tech development, production, and sales of
special optical glass and new crystal materials. Our products serve
optical electronics, consumer electronics, and the military. We
offer Sapphire optical components, mobile phone lens covers,
Ceramics, LT, Silicon Carbide SIC, Quartz, and semiconductor
crystal wafers. With skilled expertise and cutting-edge equipment,
we excel in non-standard product processing, aiming to be a leading
optoelectronic materials high-tech enterprise.
