TGV (Through-Glass Via) Glass is an advanced substrate technology
that enables vertical electrical interconnections through
micro-holes drilled into glass substrates. This innovation
leverages laser drilling, electroplating, and glass
strengthening processes to create high-performance, ultra-thin,
and transparent solutions for 3D integration.
Key Features
- Material Versatility: Compatible with borosilicate, soda-lime, quartz, and
aluminum-silicate glasses.
- High-Density Interconnectivity: Micro-vias with diameters from 5μm to 500μm and aspect ratios
exceeding 10:1.
- Electrical Performance: Low signal loss (0.02 dB/cm @ 100 GHz) and high insulation
resistance (>1×10¹⁵ Ω·cm).
- Mechanical Robustness: Chemically strengthened glass achieves strengths up to 800 MPa
(soda-lime) or 700 MPa (borosilicate).
- Thermal Compatibility: Low thermal expansion coefficients (e.g., 3.2×10⁻⁶/K for
borosilicate) for seamless integration with silicon chips.
Company Introduction
Our company, ZMSH, has been a prominent player in the semiconductor
industry for over a decade, boasting a professional team of factory experts and sales
personnel. We specialize in providing customized sapphire wafer
solutions, offering both tailored designs and OEM services to meet diverse
client needs. At ZMSH, we are committed to delivering products that excel in
both price and quality, ensuring customer satisfaction at every
stage. We invite you to contact us for more information or to
discuss your specific requirements.
Material Selection
| Type | Properties | Applications |
|---|
| Borosilicate Glass | Low CTE (3.2×10⁻⁶/K), high chemical stability | 5G RF modules, Chiplet packaging |
| Soda-Lime Glass | Cost-effective, high transparency (>90% light) | Foldable displays, consumer electronics |
| Quartz Glass | Ultra-low dielectric loss (ε=3.8), UV-IR transparent | LiDAR sensors, optical communication |
| Aluminum-Silicate | High strength (>800 MPa), low dielectric loss | Automotive displays, aerospace electronics |
| Sapphire (Al₂O₃) | Extreme hardness (9 Mohs), high thermal conductivity (35 W/m·K), IR
transparency | Military sensors, high-power lasers, extreme environments |
Key Differences:
Sapphire vs. Glass:
Material Class: Sapphire is a crystalline ceramic (not glass), but
it is often grouped with glass substrates for high-performance
applications due to its exceptional durability.
Advantages: Superior scratch resistance, higher thermal
conductivity, and IR transmission (80–100% in mid-wave IR).
Limitations: Higher cost, lower transparency in visible light
(only ~92% vs. ~99% for quartz), and difficulty in laser drilling.
TGV Glass Applications
- 5G & Telecommunications: High-frequency signal routing in RF modules.
- Automotive: Curved displays, LiDAR sensors, and power modules.
- AR/VR: Ultra-thin, foldable displays with 200,000+ bending cycles.
- Chiplet Packaging: 3D stacking for heterogeneous integration.
Product Display - ZMSH
TGV Glass FAQ
Q: What industries benefit most from TGV Glass?
A: TGV Glass is ideal for applications requiring high density,
transparency, and reliability. Key sectors include:
- Consumer Electronics (foldable smartphones, AR/VR displays).
- Automotive (curved dashboards, LiDAR sensors).
- 5G/Telecom (compact RF modules).
- Aerospace/Military (high-power sensors, extreme environments).
Q: How does TGV Glass improve device performance?
A: By enabling 3D circuitry in ultra-thin glass substrates, TGV
Glass reduces size and weight while maintaining high-speed signal
integrity. For example, it allows foldable screens to bend 200,000+
times without losing connectivity.
Q: Is TGV Glass compatible with flexible designs?
A: Yes! Chemically strengthened versions (e.g., soda-lime glass) can
bend and curve, making TGV Glass suitable for foldable phones,
rollable displays, and wearable devices.
Related Products
Sapphire Optical
Windows
