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Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates

SHANGHAI FAMOUS TRADE CO.,LTD
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    Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers
     
    Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers
    • Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers
    • Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers
    • Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers
    • Buy cheap Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates from wholesalers

    Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates

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    Brand Name : zmkj
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    Price : by case
    Payment Terms : Western Union, T/T, , MoneyGram
    Supply Ability : 100pcs
    Delivery Time : 2-4weeks
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    Semi Insulating GaN-On-Silicon Wafer Free Standing Gallium Nitride Substrates

    Gallium Nitride Substrates GaN Wafers GaN-On-Silicon Free-Standing Substrate Semi-insulting


    We can offer 2 to 8-inch gallium nitride (GaN) single crystal substrate or epitaxial sheet, and sapphire/silicon-based 2 to 8-inch GaN epitaxial sheets are available.


    The rapid development of the first and second generation semiconductor materials represented by silicon (Si) and gallium arsenide (GaAs) has promoted the rapid development of microelectronics and optoelectronics technology. However, due to the limited properties of the material, most of the devices made of these semiconductor materials can only work in the environment below 200 ° C, which can not meet the requirements of modern electronic technology for high temperature, high frequency, high pressure and anti-radiation devices.


    Gallium nitride (GaN), like silicon carbide (SiC) materials, belongs to the third generation of semiconductor materials with wide band gap width, with large band gap width, high thermal conductivity, high electron saturation migration rate, and high breakdown electric field outstanding characteristics. GaN devices have a wide range of application prospects in high frequency, high speed and high power demand fields such as LED energy-saving lighting, laser projection display, new energy vehicles, smart grid, 5G communication.


    The third-generation semiconductor materials mainly include SiC, GaN, diamond, etc., because its band gap width (Eg) is greater than or equal to 2.3 electron volts (eV), also known as wide band gap semiconductor materials. Compared with the first and second generation semiconductor materials, the third generation semiconductor materials have the advantages of high thermal conductivity, high breakdown electric field, high saturated electron migration rate, and high bonding energy, which can meet the new requirements of modern electronic technology for high temperature, high power, high pressure, high frequency and radiation resistance and other harsh conditions. It has important application prospects in the fields of national defense, aviation, aerospace, oil exploration, optical storage, etc., and can reduce energy loss by more than 50% in many strategic industries such as broadband communications, solar energy, automobile manufacturing, semiconductor lighting, and smart grid, and can reduce equipment volume by more than 75%, which is of milestone significance for the development of human science and technology.


    ItemGaN-FS-C-U-C50GaN-FS-C-N-C50GaN-FS-C-SI-C50
    Diameter50.8 ± 1 mm
    Thickness350 ± 25 μm
    OrientationC plane (0001) off angle toward M-axis 0.35 ± 0.15°
    Prime Flat(1-100) 0 ± 0.5°, 16 ± 1 mm
    Secondary Flat(11-20) 0 ± 3°, 8 ± 1 mm
    ConductivityN-typeN-typeSemi-Insulating
    Resistivity (300K)< 0.1 Ω·cm< 0.05 Ω·cm> 106 Ω·cm
    TTV≤ 15 μm
    BOW≤ 20 μm
    Ga Face Surface Roughness< 0.2 nm (polished);
    N Face Surface Roughness0.5 ~1.5 μm
    option: 1~3 nm (fine ground); < 0.2 nm (polished)
    Dislocation DensityFrom 1 x 105 to 3 x 106 cm-2 (calculated by CL)*
    Macro Defect Density< 2 cm-2
    Useable Area> 90% (edge and macro defects exclusion)

    *Can be customized according to customer requirements, different structure of silicon, sapphire, SiC based GaN epitaxial sheet


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    About our company
    SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.
    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, optics, optoelectronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects.
    It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputatiaons.
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