Micro-jet laser machine for Metal matrix composite processing wafer
cutting dicing slicing
Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and
Slicing Product Overview:
The Micro-jet Laser Machine is a cutting-edge solution designed for
high-precision processing of Metal Matrix Composites (MMCs), along
with wafer cutting, dicing, and slicing. Utilizing advanced laser
microjet (LMJ) technology, this machine provides a unique
combination of laser energy and high-speed water jet for efficient
and clean material removal, significantly reducing thermal damage
and mechanical stress on sensitive materials. Ideal for industries
such as semiconductor manufacturing, aerospace, and advanced
materials processing, the system excels in handling hard and
brittle materials like Silicon Carbide (SiC), Gallium Nitride
(GaN), and other specialized composites. Its automated, low-waste
operation ensures superior surface finishes, high-quality cuts, and
reliable, consistent results, contributing to increased yield rates
and reduced operational costs. This technology addresses
traditional processing limitations, offering a sustainable and
scalable solution for the most demanding applications in
high-performance industries.
Machine Specifications:
| Specification | Model 1 | Model 2 |
|---|
| Countertop Volume | 300 x 300 x 150 mm | 400 x 400 x 200 mm |
| Linear Motor (XY Axis) | Linear motor | Linear motor |
| Linear Motor (Z Axis) | 150 mm | 200 mm |
| Positioning Accuracy | ±5 μm | ±5 μm |
| Repeated Positioning Accuracy | ±2 μm | ±2 μm |
| Acceleration | 1 G | 0.29 G |
| Numerical Control (CNC) | 3 - axis / 3+1 axis / 3+2 axis | 3 - axis / 3+1 axis / 3+2 axis |
| Laser Type | DPSS Nd:YAG | DPSS Nd:YAG |
| Wavelength | 532 nm / 1064 nm | 532 nm / 1064 nm |
| Rated Power | 50 W / 100 W / 200 W | 50 W / 100 W / 200 W |
| Water Jet | 40 - 100 | 40 - 100 |
| Nozzle Pressure | 50 - 100 bar | 50 - 600 bar |
| Dimensions (Machine) | 1445 x 1944 x 2260 mm | 1700 x 1500 x 2120 mm |
| Dimensions (Control Cabinet) | 700 x 2500 x 1600 mm | 700 x 2500 x 1600 mm |
| Weight (Machine) | 2.5 tons | 3 tons |
| Weight (Control Cabinet) | 800 kg | 800 kg |
Processing Capabilities:
Materials Processed:
Gallium Nitride (GaN) Crystal
Ultra-Wide Band Gap Semiconductors (Diamond / Gallium Oxide)
Aerospace Special Materials
LTCC Carbon Ceramic Substrates
Photovoltaics
Scintillator Crystals
Our Advantages
Cutting-Edge Micro-jet Laser Technology
We are at the forefront of utilizing Laser Microjet (LMJ)
technology, which combines laser energy with high-speed water jets
to achieve precise and efficient material removal. This innovative
approach results in minimal thermal damage and ensures superior
quality cuts for hard and brittle materials like Silicon Carbide
(SiC), Gallium Nitride (GaN), and other advanced semiconductors.
High Efficiency and Precision
Our micro-jet laser equipment offers remarkable processing
efficiency, significantly enhancing throughput while maintaining
high precision. This capability is especially crucial in industries
such as semiconductor manufacturing and aerospace, where precision
is essential for maintaining the structural integrity of materials.
Q&A for Micro-jet Laser Machine
Q1: What is the Micro-jet Laser Machine and how does it work?
A1:
The Micro-jet Laser Machine combines advanced Laser Microjet (LMJ)
technology, which integrates a focused laser beam with a high-speed
water jet. This combination allows for precise, efficient, and
clean material removal. The water jet stabilizes the laser,
reducing thermal damage and mechanical stress while ensuring
high-precision cuts in hard and brittle materials.
Q2: What materials can the Micro-jet Laser Machine process?
A2:
The Micro-jet Laser Machine is highly versatile and can process a
wide range of materials, including:
Silicon Carbide (SiC)
Gallium Nitride (GaN)
Ultra-Wide Bandgap Semiconductors (Diamond, Gallium Oxide)
Aerospace Special Materials
LTCC Carbon Ceramic Substrates
Photovoltaic Components
Scintillator Crystals
It is suitable for industries such as semiconductor manufacturing,
aerospace, and advanced materials processing.
