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Pico-precision Laser Drilling Machine for Sapphire bearing processing

SHANGHAI FAMOUS TRADE CO.,LTD
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    Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers
     
    Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers
    • Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers
    • Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers
    • Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers
    • Buy cheap Pico-precision Laser Drilling Machine for Sapphire bearing processing from wholesalers

    Pico-precision Laser Drilling Machine for Sapphire bearing processing

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    Brand Name : ZMSH
    Payment Terms : T/T
    Delivery Time : 6-8months
    • Product Details
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    Pico-precision Laser Drilling Machine for Sapphire bearing processing

    Product Overview


    The equipment combines ultra-fast picosecond laser technology with intelligent control systems, designed for high-value material precision processing. Key advantages include:

    • ​Picosecond-level Ultra-fast Processing: 1064nm wavelength pulsed laser with energy levels adjustable from 0.1mJ to 5mJ (step size 0.1mJ), delivering pulse durations <10^-12 seconds. This minimizes thermal damage (<10μm heat-affected zone) and eliminates micro-cracking.
    • ​Full Digital Closed-loop Control: Equipped with industrial-grade PCs and proprietary ​LaserMaster Pro​ software, supporting G-code programming, CAD auto-conversion, and real-time path optimization. Positioning accuracy reaches ±0.005mm.
    • 4-Axis Intelligent System: XYZ axes with ±0.002mm repeatability and optional C-axis rotation enable complex multi-tasking for irregular hole patterns.

    Typical Applications:

    • Semiconductor industry: Wafer drilling, micro-structure fabrication
    • Ultra-hard materials: Diamond tooling,apphire optical component micro-drilling
    • Biomedical field: Artificial joints, dental implants precision drilling
    • New energy sector: Lithium-ion battery micro-porous array processing



    Technical Specifications


    Category

    SpecificationsTechnical Highlights
    Laser SystemPico-fiber laser, peak power ≥20kWMOPA (Master Oscillator Power Amplifier) tech, pulse stability <3%
    Motion Control​4-axis servo motors, ±0.002mm repeatabilityGrating scale feedback + adaptive damping algorithm, max speed 500mm/s
    Vision System150x zoom optics + black-and-white CCD camera0.1μm resolution imaging, electronic crosshair alignment for pinpointing
    ​Energy Control​Stepwise energy adjustment (0.1mJ increments)Optimized for varying material thicknesses
    ​Auxiliary SystemsDual-mode cooling (water/air), vacuum chuckSuitable for continuous operation and hazardous material processing

    ​​​



    Processing Performance & Quality Assurance


    1. Exceptional Processing Capabilities

    • Micro-drilling: Minimum aperture φ0.5μm, depth-to-diameter ratio up to 1:50 (no chipping in hard materials)
    • Complex Structures: Supports conical holes (0.1°–5° adjustable), spiral grooves, and multi-stage holes in one process
    • Non-destructive Cutting: Ideal for thin films (e.g., PI film, graphene) with sub-micron precision

    2. End-to-End Quality Management

    • Smart Compensation: Real-time monitoring of laser power fluctuations and thermal deformation with dynamic parameter adjustments
    • Process Database: Pre-built parameters for over 200 materials (metals, ceramics, gemstones, composites)
    • In-line Inspection: Automated generation of hole size distribution maps and surface roughness analysis reports (Ra ≤0.8μm)

    3. Material Compatibility Test Results

    Material TypeTypical Processing Outcome
    Polycrystalline Diamond (PCD)φ2μm holes with smooth edges/no burrs
    18K GoldSub-micron hollow patterns without oxidation
    Tungsten Carbide (WC)Diameter tolerance ±1.5%, depth-to-diameter ratio 1:30
    Bio-GlassLow thermal stress drilling, >95% cell viability



    ZMSH Pico-precision Laser Drilling Machine


    Pico-precision Laser Drilling Machine for Sapphire bearing processing Pico-precision Laser Drilling Machine for Sapphire bearing processingPico-precision Laser Drilling Machine for Sapphire bearing processing




    FAQs


    Q: Is the equipment commissioning time-consuming?

    A: Pre-installed parameter packages enable 30-minute basic functional verification. Remote guidance by our team can further reduce setup time to ​2 hours.


    Q: How to handle multi-material sequential cutting?

    A: Supports multi-layer processing modes with automatic tool change and parameter switching between materials like stainless steel and ceramics.


    ​Q: What is the energy consumption?

    A: Energy-efficient design (40% lower than conventional systems) with smart standby mode. Hourly operating cost ​<¥5.


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