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350um Thickness 4h-N 4H-SEMI SIC Silicon Carbide Wafer For Epitaxial

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350um Thickness 4h-N 4H-SEMI SIC Silicon Carbide Wafer For Epitaxial

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Brand Name :	ZMKJ
Model Number :	4inch sic wafers
Price :	by case
Payment Terms :	T/T, Western Union, MoneyGram
Supply Ability :	1-50pcs/month
Delivery Time :	1-6weeks

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Product Details
Company Profile

350um Thickness 4h-N 4H-SEMI SIC Silicon Carbide Wafer For Epitaxial

Customzied size/2inch/3inch/4inch/6inch 6H-N/4H-SEMI/ 4H-N SIC ingots/High purity 4H-N 4inch 6inch dia 150mm silicon carbide single

sic wafer 4Inch prime research dummy Grade 4H-N/SEMI standard size

About Silicon Carbide (SiC)Crystal

Silicon carbide (SiC), also known as carborundum, is a semiconductor containing silicon and carbon with chemical formula SiC. SiC is used in semiconductor electronics devices that operate at high temperatures or high voltages, or both.SiC is also one of the important LED components, it is a popular substrate for growing GaN devices, and it also serves as a heat spreader in high-power LEDs.

1. Description

Property	4H-SiC, Single Crystal	6H-SiC, Single Crystal
Lattice Parameters	a=3.076 Å c=10.053 Å	a=3.073 Å c=15.117 Å
Stacking Sequence	ABCB	ABCACB
Mohs Hardness	≈9.2	≈9.2
Density	3.21 g/cm3	3.21 g/cm3
Therm. Expansion Coefficient	4-5×10-6/K	4-5×10-6/K
Refraction Index @750nm	no = 2.61 ne = 2.66	no = 2.60 ne = 2.65
Dielectric Constant	c~9.66	c~9.66
Thermal Conductivity (N-type, 0.02 ohm.cm)	a~4.2 W/cm·K@298K c~3.7 W/cm·K@298K
Thermal Conductivity (Semi-insulating)	a~4.9 W/cm·K@298K c~3.9 W/cm·K@298K	a~4.6 W/cm·K@298K c~3.2 W/cm·K@298K
Band-gap	3.23 eV	3.02 eV
Break-Down Electrical Field	3-5×106V/cm	3-5×106V/cm
Saturation Drift Velocity	2.0×105m/s	2.0×105m/s

4H-N 4inch diameter Silicon Carbide (SiC) Substrate Specification

2inch diameter Silicon Carbide (SiC) Substrate Specification
Grade		Zero MPD Grade	Production Grade	Research Grade	Dummy Grade

Diameter		100. mm±0.5mm

Thickness		350 μm±25μm or 500±25um Or other customized thickness

Wafer Orientation		Off axis : 4.0° toward <1120> ±0.5° for 4H-N/4H-SI On axis : <0001>±0.5° for 6H-N/6H-SI/4H-N/4H-SI

Micropipe Density		≤0 cm-2	≤1cm-2	≤5cm-2	≤10 cm-2

Resistivity	4H-N	0.015~0.028 Ω•cm

	6H-N	0.02~0.1 Ω•cm

	4/6H-SI	≥1E5 Ω·cm

Primary Flat		{10-10}±5.0°

Primary Flat Length		18.5 mm±2.0 mm

Secondary Flat Length		10.0mm±2.0 mm

Secondary Flat Orientation		Silicon face up: 90° CW. from Prime flat ±5.0°

Edge exclusion		1 mm

TTV/Bow /Warp		≤10μm /≤10μm /≤15μm

Roughness		Polish Ra≤1 nm

		CMP Ra≤0.5 nm

Cracks by high intensity light		None		1 allowed, ≤2 mm	Cumulative length ≤ 10mm, single length≤2mm


Hex Plates by high intensity light		Cumulative area ≤1%		Cumulative area ≤1%	Cumulative area ≤3%

Polytype Areas by high intensity light		None		Cumulative area ≤2%	Cumulative area ≤5%


Scratches by high intensity light		3 scratches to 1×wafer diameter cumulative length		5 scratches to 1×wafer diameter cumulative length	5 scratches to 1×wafer diameter cumulative length


edge chip		None		3 allowed, ≤0.5 mm each	5 allowed, ≤1 mm each

Production display show

CATALOGUE COMMON SIZE In OUR INVENTORY LIST

4H-N Type / High Purity SiC wafer/ingots 2 inch 4H N-Type SiC wafer/ingots 3 inch 4H N-Type SiC wafer 4 inch 4H N-Type SiC wafer/ingots 6 inch 4H N-Type SiC wafer/ingots	4H Semi-insulating / High Purity SiC wafer 2 inch 4H Semi-insulating SiC wafer 3 inch 4H Semi-insulating SiC wafer 4 inch 4H Semi-insulating SiC wafer 6 inch 4H Semi-insulating SiC wafer
6H N-Type SiC wafer 2 inch 6H N-Type SiC wafer/ingot	Customzied size for 2-6inch

SiC Applications

Application areas

1 high frequency and high power electronic devices Schottky diodes, JFET, BJT, PiN,
diodes, IGBT, MOSFET
2 optoelectronic devices: mainly used in GaN/SiC blue LED substrate material (GaN/SiC) LED

>Packaging – Logistcs
we concerns each details of the package , cleaning, anti-static , shock treatment .

According to the quantity and shape of the product , we will take a different packaging process! Almost by single wafer cassettes or 25pcs cassette in 100 grade cleaning room.

FAQ

Q1. Are you a factory?

A1. Yes, we are a professional manufacturer of optical components,
we have more than 8years experience in wafers and optical lens
process.

Q2. What is the MOQ of your products?

A2. No MOQ for customer if our product is in stock, or 1-10pcs.

Q3:Can I custom the products based on my requirement?

A3.Yes, we can custom the material, specifications and optical
coating for youroptical components as your requirement.

Q4. How can I get sample from you?

A4. Just send us your requirements, then we will sendsamples
accordingly.

Q5. How many days will samples be finished? How about mass
products?

A5. Generally, we need 1~2weeks to finish the sample production. As
for the mass products, it depends on your order quantity.

Q6. What's the delivery time?

A6. (1)For inventory: the delivery time is 1-3 working days. (2)
For customized products: the delivery time is 7 to 25 working days.
According to the quantity.

Q7. How do you control the quality?

A7. More than four times quality inspect during production
process,we can provide the Quality test report.

Q8. How about your optical lens production ability per Month?

A8. About 1,000pcs/Month.According to the detail requirement.

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