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8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer

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    Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers
     
    Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers
    • Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers
    • Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers
    • Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers
    • Buy cheap 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer from wholesalers

    8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer

    Ask Lasest Price
    Brand Name : ZMKJ
    Model Number : 200mm SiC wafers
    Certification : ROHS
    Price : by case
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 1-50pcs/month
    Delivery Time : 1-6weeks
    MOQ : 1
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    8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer

    SiC Substrate/Wafers (150mm, 200mm) Silicon Carbide Ceramic Excellent CorrosionSingle crystal single side polished silicon wafer sic wafer polishing wafer manufacturer Silicon Carbide SiC Wafer4H-N SIC ingots/200mm SiC Wafers 200mm SiC Wafers


    About Silicon Carbide (SiC)Crystal


    Silicon carbide (SiC), also known as carborundum, is a semiconductor containing silicon and carbon with chemical formula SiC. SiC is used in semiconductor electronics devices that operate at high temperatures or high voltages, or both.SiC is also one of the important LED components, it is a popular substrate for growing GaN devices, and it also serves as a heat spreader in high-power LEDs.

    8inch N-type SiC DSP Specs
    NumberItemUnitProductionResearchDummy
    1:parameters
    1.1polytype--4H4H4H
    1.2surface orientation°<11-20>4±0.5<11-20>4±0.5<11-20>4±0.5
    2:Electrical parameter
    2.1dopant--n-type Nitrogenn-type Nitrogenn-type Nitrogen
    2.2resistivityohm ·cm0.015~0.0250.01~0.03NA
    3:Mechanical parameter
    3.1diametermm200±0.2200±0.2200±0.2
    3.2thicknessμm500±25500±25500±25
    3.3Notch orientation°[1- 100]±5[1- 100]±5[1- 100]±5
    3.4Notch Depthmm1~1.51~1.51~1.5
    3.5LTVμm≤5(10mm*10mm)≤5(10mm*10mm)≤10(10mm*10mm)
    3.6TTVμm≤10≤10≤15
    3.7Bowμm-25~25-45~45-65~65
    3.8Warpμm≤30≤50≤70
    3.9AFMnmRa≤0.2Ra≤0.2Ra≤0.2

    The current difficulties in the preparation of 200mm 4H-SiC crystals mainly involve.
    1) The preparation of high-quality 200mm 4H-SiC seed crystals;
    2) Large size temperature field non-uniformity and nucleation process control;
    3) The transport efficiency and evolution of gaseous components in large size crystal growth systems;
    4) Crystal cracking and defect proliferation caused by large size thermal stress increase.

    There are three types of SiC power diodes: Schottky diodes (SBD), PIN diodes and junction barrier-controlled Schottky diodes (JBS). Because of the Schottky barrier, SBD has a lower junction barrier height, so SBD has the advantage of low forward voltage. The emergence of SiC SBD has enlarged the application range of SBD from 250V to 1200V. In addition, its characteristics at high temperatures are good, the reverse leakage current does not increase from room temperature to 175 ° C. In the application field of rectifiers above 3kV, SiC PiN and SiC JBS diodes have received much attention due to their higher breakdown voltage, faster switching speed, smaller size, and lighter weight than silicon rectifiers.


    SiC power MOSFET devices have ideal gate resistance, high-speed switching performance, low on-resistance, and high stability. It is the preferred device in the field of power devices below 300V. There are reports that a silicon carbide MOSFET with a blocking voltage of 10kV has been successfully developed. Researchers believe that SiC MOSFETs will occupy an advantageous position in the field of 3kV - 5kV.


    SiC Insulated Gate Bipolar Transistors (SiC BJT, SiC IGBT) and SiC Thyristor (SiC Thyristor), SiC P-type IGBT devices with a blocking voltage of 12 kV have good forward current capability. Compared with Si bipolar transistors, SiC bipolar transistors have 20-50 times lower switching losses and lower turn-on voltage drops. SiC BJT is mainly divided into epitaxial emitter BJT and ion implantation emitter BJT, the typical current gain is between 10-50.

    PropertiesunitSiliconSiCGaN
    Bandgap widtheV1.123.263.41
    Breakdown fieldMV/cm0.232.23.3
    Electron mobilitycm^2/Vs14009501500
    Drift velocity10^7 cm/s12.72.5
    Thermal conductivityW/cmK1.53.81.3

    FAQ:

    Q: What's the way of shipping and cost?

    A:(1) We accept DHL, Fedex, EMS etc.

    (2) it is fine If you have your own express account ,If not,we could help you ship them and

    Freight is in accordance with the actual settlement.


    Q: How to pay?

    A: T/T 100% deposit before delivery.


    Q: What's your MOQ?

    A: (1) For inventory, the MOQ is 1pcs. if 2-5pcs it's better.

    (2) For customized commen products, the MOQ is 10pcs up.


    Q: What's the delivery time?

    A: (1) For the standard products

    For inventory: the delivery is 5 workdays after you place the order.

    For customized products: the delivery is 2 -4 weeks after you order contact.


    Q: Do you have standard products?

    A: Our standard products in stock. as like substrates 4inch 0.35mm.


    Quality 8inch 200mm Silicon Carbide Ingot Semiconductor Substrate 4H N-Type SiC Wafer for sale
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